Wire bonder at UCSF

An instrument that is used to make interconnections between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication.
→ Wire bonder
Filter by location:
Mission Bay

Biomedical Micro and Nanotechnology Core (BMNC)

Mission Bay
Contact: Illya Gordon 415-476-6109 admin-qbi@ucsf.edu

  • Kulicke and Soffa Model 4526 Wire Bonder