Wire bonder at UCSF

An instrument that is used to make interconnections between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication.
→ Wire bonder
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Mission Bay

Biomedical Micro and Nanotechnology Core (BMNC)

Mission Bay
Contact: Illya Gordon (415) 514-4953 illya.gordon@ucsf.edu

  • Kulicke and Soffa Model 4526 Wire Bonder