Wire bonder at UCSF
- Definition
- An instrument that is used to make interconnections between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication.
- Categories
- Instrument → Wire bonder
Filter by location:
Mission Bay
Biomedical Micro and Nanotechnology Core (BMNC)
Mission Bay
Contact: Illya Gordon
415-476-6109
admin-qbi@ucsf.edu
- Kulicke and Soffa Model 4526 Wire Bonder